JPH0475672B2 - - Google Patents

Info

Publication number
JPH0475672B2
JPH0475672B2 JP21695682A JP21695682A JPH0475672B2 JP H0475672 B2 JPH0475672 B2 JP H0475672B2 JP 21695682 A JP21695682 A JP 21695682A JP 21695682 A JP21695682 A JP 21695682A JP H0475672 B2 JPH0475672 B2 JP H0475672B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
sheet
circuit board
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP21695682A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59107584A (ja
Inventor
Yukio Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP57216956A priority Critical patent/JPS59107584A/ja
Publication of JPS59107584A publication Critical patent/JPS59107584A/ja
Publication of JPH0475672B2 publication Critical patent/JPH0475672B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Devices (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
JP57216956A 1982-12-13 1982-12-13 発光ダイオ−ド Granted JPS59107584A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57216956A JPS59107584A (ja) 1982-12-13 1982-12-13 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57216956A JPS59107584A (ja) 1982-12-13 1982-12-13 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS59107584A JPS59107584A (ja) 1984-06-21
JPH0475672B2 true JPH0475672B2 (en]) 1992-12-01

Family

ID=16696546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57216956A Granted JPS59107584A (ja) 1982-12-13 1982-12-13 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS59107584A (en])

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW507482B (en) * 2000-06-09 2002-10-21 Sanyo Electric Co Light emitting device, its manufacturing process, and lighting device using such a light-emitting device
DE10041328B4 (de) 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
US6949771B2 (en) * 2001-04-25 2005-09-27 Agilent Technologies, Inc. Light source
TW591990B (en) * 2001-07-25 2004-06-11 Sanyo Electric Co Method for making an illumination device
DE10228634A1 (de) * 2002-06-26 2004-01-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbare Miniatur-Lumineszenz-und/oder Photo-Diode und Verfahren zu deren Herstellung
TWI275189B (en) * 2003-12-30 2007-03-01 Osram Opto Semiconductors Gmbh Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component
DE10361801A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Strahlungsemittierendes und/oder strahlungsempfangendes Halbleiterbauelement und Verfahren zu dessen Herstellung
JP2008047836A (ja) * 2006-08-21 2008-02-28 Hamamatsu Photonics Kk 半導体装置および半導体装置製造方法
TWI431218B (zh) * 2011-03-11 2014-03-21 Lingsen Precision Ind Ltd The manufacturing method and structure of LED light bar

Also Published As

Publication number Publication date
JPS59107584A (ja) 1984-06-21

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